The Center for Joining and Electronic packaging was originated from the welding research office established in the early 1970s and renamed to the center for Joining and Electronic Packaging after combining with the electronic packaging research office in recent years.

The center currently undertakes the main teaching and research tasks of disciplines of the welding and electronic packaging, and has a professional faculty team including 7 professors, 5 associate professors and 2 lecturers. In recent years, the center has undertaken multiple research projects funded both from industry and scientific foundations such as National natural Science Foundation of China, National Key Basic Research Program of China (973 Program), National High Technology Research and Development Program of China (863 Program), the National Defense Foundation of China, and National Key R&D Program of China. The center has won the First National prize for Progress in Science and Technology once, the first prize of provincial and ministerial level scientific and technological progress awards three times. The institute has the authorization to issue more than 50 national invention patents and has published more than 400 academic papers in the important journals and conferences.

Main Directions:

   1) Wire and arc additive manufacturing of high performance metals

   2) Numerical simulation of metallurgy of welding/additive manufacturing

3) High mobility semiconductor materials, devices and packing technology for integrated circuit industry:

   4) Laser welding of large thick/thin wall structures

   5) High quality and effective laser cleaning technology.

Members: 

Professor: WU Yiping, YU Shengfu, WU Fengshun, WANG Chunming, LIU Dejian, ZHANG Wenfeng

Associate Professor: ZHOU Longzao, HUANG Anguo, XIA Weisheng, MI Gaoyang

Lecture: LV Weiwen, CHEN Ying